Saturday, February 2, 2013

Spintronics Used To Create 3D Microchip

Get off my lawn! I was involved in a sputtering project, production not experimental, in 1968.

It is a well-known industrial method for various kinds of non-obvious plating, such as aluminum on PVC. In the experience I referred to above, aluminum, platinum and/or gold were layered onto glass and silicon substrates.

It is how the aluminum interconnect layer is deposited on silicon chips, after all.

Source: http://rss.slashdot.org/~r/Slashdot/slashdotScience/~3/8Co1o5Kqr2E/story01.htm

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